MediaTek Dimensity 8300 chipset unveiled with support for Generative AI, Stable Diffusion

MediaTek on Tuesday unveiled the Dimensity 8300 as the company’s latest processor for Android smartphones. Built on TSMC’s advanced second-generation 4nm process technology, it has 20 percent better performance and 30 percent lower power consumption than its predecessor. The company’s new chipset offers full generative AI support, including technologies such as large language models (LLM) and stable diffusion. According to the company, the chip supports 320-megapixel cameras and 5G network downlink speeds of up to 5.17Gbps.

The newly unveiled Dimensity 8300 mobile processor is an octa-core chip with four Arm Cortex-A715 performance cores and four Cortex-A510 efficiency cores, clocked at 3.35GHz and 2.2GHz respectively. It supports LPDDR5x memory and UFS 4 storage with Multi-Circular Queue (MCQ) support. Of earlier benchmark score There are suggestions that this chip could keep pace with Qualcomm’s second most powerful chip, the Snapdragon 8 Gen 2 SoC.

In addition to the aforementioned CPU improvements, the chip features a Mali-G615 GPU that is claimed to use 55 percent less power while offering 60 percent better performance than last year’s model. According to the company, the chip also features MediaTek’s HyperEngine game technology that monitors the device’s temperature and keeps the device from overheating during gaming sessions.

For photos and videos, the MediaTek Dimensity 8300 features an Imagick 980 ISP, which is claimed to deliver 4K60fps HDR with support for longer video recording due to improved power consumption. It supports smartphone cameras with a maximum resolution of 320 megapixels.

MediaTek has equipped the Dimensity 8300 with an APU 780 AI processor with the same architecture as the more advanced Dimensity 9300 chipset, increasing INT/FP16 count and AI performance by 2x and 3.3x respectively. Meanwhile, according to the chipmaker, it supports up to 10 billion parameters as well as on-device generative AI technology for stable diffusion.

On the connectivity front, the new Dimensity 8300 features a 3GPP release-16 modem with 5G and 4G LTE support. The chipset comes with Wi-Fi 6E and Bluetooth 5.4 support as well as GPS, GLONASS and NavIC support for GPS-based navigation.

According to MediaTek, 5G handsets running on the newly unveiled Dimensity 8300 chip will be launched before the end of the year. This chip is expected to compete with Qualcomm’s Snapdragon 8 Gen 2 and Snapdragon 8+ Gen 1 chips. Although specific models featuring the MediaTek chip are yet to be announced, we can expect the smartphone maker to announce upcoming models featuring the mobile chipset in the coming weeks and months.


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Xiaomi Mix Flip, Xiaomi Pad 7 Pro, Redmi K70 are reported to have Snapdragon 8 Gen 2 SoC.

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